The CHIPS for Science conference will engage stakeholders from defense, national laboratories, universities, and industry to explore how national investments in advanced packaging can be leveraged for research across a broad range of scientific disciplines, including but not limited to biotechnology, geophysics, astronomy, quantum and AI hardware, chemistry, and physics. Experts in these fields will learn from packaging experts what it is possible to achieve using advanced packaging. In addition, this conference will allow advanced packaging experts and packaging facility directors to learn about the types of packaging architectures and technologies that will be demanded by scientific researchers in the future.
This bidirectional exchange of expertise is both timely and critical because scientific research is often a leading-edge market that predicts what future industry needs might be. Therefore, this conference will provide significant value both to researchers by allowing them to better plan for their future research, and to packaging prototyping facilities by allowing them to find new, future customers that will be willing to produce innovative designs and who are risk-tolerant during the prototyping phase of the development of new packaging technologies.
1. Sensors and detectors for physical and chemical science, where the ability to build 3D stacks of interconnected sensors and readout circuits would drive down response time while improving resolution.
2. 3D heterogeneous integration for biomedical and environmental applications, where sensors need to be packaged with memory and logic on-chip for preprocessing of huge amounts of data prior to transmission to a wireless receiver.
 3. Quantum and AI hardware, where integration of qubits and microwave-to-optical transduction chips has become stalled out with the limitations imposed by traditional packaging.
The welcome reception will be held at The Carillon Restaurant, located on the hotel side of the AT&T Hotel and Conference Center.
Fernanda Leite, Ph.D., The University of Texas at Austin
Michael Cullinan, Ph.D., The University of Texas at Austin
Subramanian S. Iyer, Ph.D., University of California, Los Angeles
S.V. Sreenivasan, Ph.D., Texas Institute of Electronics
This talk will overview resources available to aid researchers in transitioning their designs to production in the TIE Fab.
Jaydeep Kulkarni, Ph.D., Texas Institute of Electronics & The University of Texas at Austin
Don Figer, Ph.D., Rochester Institute of Technology
Ellis Meng, Ph.D., University of Southern California
Ajey Jacob, Ph.D., University of Southern California, Information Sciences Institute
The reception and dinner will be held in the Tejas Dining Room, located on the hotel side of the AT&T Hotel and Conference Center.
Maurice Garcia-Sciveres, Ph.D., Lawrence Berkeley National Laboratory
Tom Kazior, Ph.D., Texas Institute for Electronics
Pavan Kumar Hanumolu, Ph.D., University of Illinois Urbana Champaign
Moderated by Puneet Gupta, Ph.D., University of California, Los Angeles
The CHIPS for Science Conference will be held in the Guadalupe and Lavaca Classrooms of Robert B. Rowling Hall on the University of Texas at Austin campus.
Complimentary parking will be available in the Robert B. Rowling Hall parking garage.
